News and Events
Skymizer and VIA NEXT Collaborate to Advance Next-Generation AI Inference Infrastructure and Chiplet Integration Ecosystem
May 27, 2026
Partnership Focuses on AI Inference Infrastructure, Advanced Packaging, Chiplet Integration, LPU Evaluation, EVB/DVB Development, and System-Level Validation Taipei, Taiwan – May 27,2026 – Skymizer, an AI
VIA NEXT Joins Arm Total Design Ecosystem to Accelerate Next-Generation AI and HPC Innovations
October 14, 2025
VIA NEXT, a leading provider of system-level design services, today announced its participation in the Arm® Total Design ecosystem.