WHAT IS
VIA NEXT?
VIA NEXT has a proven track record of assisting customers in advanced manufacturing processes and mass production of complex IC designs.
History of
VIA NEXT
VIA NEXT has over 20 years of experience in IC design, boasting a highly-experienced team with expertise in IC development and mass production.
Founded in
2021
Location
Taipei, Shanghai
Employees
200+ employees (over 80% R&D and engineering employees)
Services
Back-end services for IC design
Key Milestones
VIA NEXT
Through close cooperation with our supply chain partners and continuous investment in developing advanced manufacturing processes, VIA NEXT can help you choose the most suitable process to meet your IC design’s performance, power consumption, cost, and development needs across various application fields.
28nm Project
x86 CPU/Chipset SoC for Desktop/Notebook PC, in MP
ARM-based Mobile Application Processor SoC, in MP
Test chip of x86 CPU/Chipset SoC for HPC
ARM-based SoC for Set-Top-Box and Network, in MP
16nm Project
x86 CPU/Chipset SoC for Desktop/Notebook PC, in MP
x86 CPU/Chipset/AI Processor SoC, ready for MP
x86 CPU/Chipset SoC for Server Applications, in development
6nm Project
Test chip development of x86 CPU/Chipset SoC
28nm Project
x86 CPU/Chipset SoC for Desktop/Notebook PC, in MP
ARM-based Mobile Application Processor SoC, in MP
Test chip of x86 CPU/Chipset SoC for HPC
ARM-based SoC for Set-Top-Box and Network, in MP
16nm Project
x86 CPU/Chipset SoC for Desktop/Notebook PC, in MP
x86 CPU/Chipset/AI Processor SoC, ready for MP
x86 CPU/Chipset SoC for Server Applications, in development
6nm Project
Test chip development of x86 CPU/Chipset SoC
