Skymizer and VIA NEXT Collaborate to Advance Next-Generation AI Inference Infrastructure and Chiplet Integration Ecosystem
Partnership Focuses on AI Inference Infrastructure, Advanced Packaging, Chiplet Integration, LPU Evaluation, EVB/DVB Development, and System-Level Validation Taipei, Taiwan – May 27,2026 – Skymizer, an AI inference infrastructure company and creator of the HyperThought™ LPU platform, today announced a strategic collaboration with VIA NEXT Technologies, a leading provider of system-level semiconductor design services and advanced chiplet […]