VIA NEXT

Manufacturing Design

We provide:

Production Management

Production Management

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Package Design

Package Design

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Failure Analysis

Failure Analysis

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Reliability Testing

Reliability Testing

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Design for Manufacturing

Production Management

VIA NEXT can assist in managing the complexity of manufacturing advanced semiconductor products.

From facilitating information exchange with wafer manufacturing, packaging and testing partners, to streamlining technology, schedule, quality, and materials management, VIA NEXT is your partner throughout the entire manufacturing process.

We provide:

Design for Manufacturing

Package Design

As the requirements of modern IC design become more demanding, VIA NEXT’s expertise in the design and development of complex chip packages means that we can assist in developing the most suitable package design for your product applications.

We provide:

Design for Manufacturing

Failure Analysis

VIA NEXT provides comprehensive, industry-leading failure analysis services to ensure that you can make your products more robust when things go wrong.

We provide:

Design for Manufacturing

Reliability Testing

By partnering with VIA NEXT, we can ensure that your IC design meets stringent production requirements and is robust throughout the entire product lifecycle.

We provide: