VIA NEXT Joins Arm Total Design Ecosystem to Accelerate Next-Generation AI and HPC Innovations

Taipei, Taiwan – October 14, 2025  – VIA NEXT, a leading provider of system-level design services, today announced its participation in the Arm® Total Design ecosystem. This collaboration indicates VIA NEXT’s commitment to offer innovative design solutions optimized for AI and high-performance computing (HPC) applications.

As a Leading System-Level Design Services Provider, VIA NEXT brings extensive expertise in system integration and chip design, delivering complete end-to-end solutions including SoC architecture to engineering validation board (EVB), and chip probe (CP) to system-level testing (SLT), supporting client innovation from concept to mass production.

With Proven Experience in Complex Chiplet Integration, VIA NEXT has successfully executed multiple heterogeneous integration projects leveraging chiplet methodologies. Its experience with the Arm Chiplet System Architecture (CSA) allows VIA NEXT to deliver modular, scalable, and high-performance solutions tailored to the evolving demands of semiconductor innovation.

VIA NEXT’s strong Focus on Next-Gen AI & HPC Designs with Advanced Package further achieves the mission of the Arm Total Design ecosystem. By applying its chiplet and advanced packaging expertise to AI, edge computing, data centers, and supercomputing applications, VIA NEXT empowers customers with the competitive advantage needed to lead in emerging markets.

In addition, VIA NEXT has established a Proven Track Record with Diverse Global Partners, building long-term collaborations with leading semiconductor companies worldwide. These successful partnerships demonstrate VIA NEXT’s strong project management capabilities and its commitment to delivering breakthrough solutions across diverse application domains.

“By joining the Arm Total Design ecosystem, VIA NEXT is well-positioned to accelerate the deployment of advanced AI and HPC solutions through chiplet-based architectures and next-generation system integration,” said Brian Wang, President of VIA NEXT. “We look forward to working closely with Arm to enable faster innovation cycles and bring groundbreaking products to market, strengthening our customers’ leadership in AI and HPC.”

“Arm Total Design helps remove barriers to purpose-built silicon, giving partners the foundation and ecosystem they need to bring solutions to market faster,” said Eddie Ramirez, vice president of go-to-market, Infrastructure Business, Arm. “With proven expertise in advanced packaging and complex chip integration, VIA NEXT will help our mutual partners scale new Arm-based SoCs for AI and HPC applications and unlock more opportunities for innovation across the semiconductor industry.”